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Thermal Analysis

Thermal Simulations


Thermal SimulationsCFD Simulation
High power density systems, such as AdvancedTCA®, microTCA and others are supplied with high power cooling mechanisms but the real cooling requirement is defined by the dissipation and allowable temperatures of the boards.  Cooling performance will vary with the mix of the boards and their airflow impedance.  In many cases the cooling performance cannot be predicted without this information.

Comtel offer thermal CFD simulation to determine how specific customer boards will behave in a given Comtel shelf product.

Airflow cross section, Front viewAirflow cross section, Front view
       

Airflow with specific board airflow impedancesAirflow with specific board airflow impedances

Numerical analysisNumerical analysis

There is a further need to run several ‘what-if’ scenarios to determine system performance.  This can be expensive, time consuming and unnecessarily complex  for a first level assessment.

Comtel provide a numerical analysis based on the vendor supplied shelf and board pressure-flow curves.  This provides results for each board mix option within minutes.

An example of such an analysis is shown

 

 

 
 

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